Thursday, January 14, 2010: 03:27:49 PM

INDIAPACK 2010 Launched

The launch cum press meet was organised on 11th January, 2010 at Mumbai by the Indian Institute of Packaging (IIP), the premier Institute in the country and an autonomous body working under Ministry of Commerce & Industry, Government of India for INDIAPACK 2010 scheduled from 30th September – 3rd October, 2010.

The main objective of INDIAPACK 2010 is to provide the Indian packaging industry a unique platform where the Indian packaging industry would showcase state-of-the-art packaging technology and machinery, products and services along with International companies providing effective packaging solutions in terms of costs, productivity suitability and quality.

The welcome speech by Sanjay Bhatia, Chairman, IIP urged the packaging industry to be a part to this prestigious event which has opened doors to the Indian Packaging industry to show case it’s potential to the world. Director IIP, N. C. Saha, threw light on the current scenario on Indian Packaging Industry and which was the need of hour. The speech by Chief Guest, P. K. Dash, Joint Secretary, MOC&I Govt. of India gave the glimpses what government has in store to the packaging industry in India. He urged the industry to go to the rural places and grab the opportunity and also educate the entrepreneur who can compete with the small and medium entrepreneurs in cities. He also emphasised the need to enhance exports by which the country can progress. He stated that the exhibition should also be held in remote places in various parts of the country to educate the small manufacturers who can be benefited with developing various packages in which they are expertise. Ashwini Pande, MD, Kolenmesse gave a briefed guide line of how they would be arranging the International show and which are the countries who have agreed to participate. Diwakar Shetty, Chairman, Exhibition Committee proposed vote of thanks.

The programme, conducted by Shekhar Amberkar, Asst.Director, Exhibition & Design, Indian Institute of Packaging highlighted that an International Packaging Summit with theme ‘Packaging Innovations & Sustainability’ is also planned on 30th September  and 1st October, 2010. Renowned experts, world over will present their papers to cover topics as prospects of packaging industries, printing technology, converting technology, packaging media, packaging system & machinery, package testing & evaluation, package distribution etc. The National Awards for Packaging Excellence viz. INDIASTAR & PACMACHINE will be also be conducted. It is estimated that the vent would witness a growth of about 25% from INDIAPACK 2010 and cover a space of about 10,000 sq.mts.

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