A partial plating ring from Link Upon Advanced Material Corp, Taipei, Taiwan, is made of Solvay Advanced Polymers’ KetaSpire® polyetheretherketone (PEEK) resin for strong chemical resistance, high heat deflection temperature, low creep and exceptional dimensional stability. The plating ring is used for gold plating of electronic LED lead frames.

The PEEK plating ring offers LED lead frame makers a more efficient and less costly process than traditional plating processes like dipping and brushing. It controls the plating thickness to save on gold consumption while lowering cost.

KetaSpire PEEK’s low coefficient of linear thermal expansion (CLTE) helps to ensure strong dimensional stability and tight tolerances. PEEK plating rings are also more durable.

KetaSpire PEE K is one of the most chemically resistant plastics and offers excellent strength, superior fatigue resistance and a heat deflection temperature (HDT) up to 315°C (599°F). It also provides excellent long-term thermal oxidative stability, continuous use temperature of 240°C and outstanding chemical resistance to organics, acids, bases, and steam or hot water.

Link Upon injection moulds the part and then machines the final product with several tiny holes. The plating ring has an outer diameter of 256 mm and inner diameter of 220 mm with varying heights for different lead frame designs.

For further details please contact:
Solvay Advanced Polymers, L.L.C., USA
Web: www.solvayadvancedpolymers.com